The film uniformity on magnetron sputtering with multi-workbench
This paper has presented a new type of multi-site magnetron sputtering system,which has more than one workbench. Based on the operating principle of the magnetron sputtering system with a circular plane target,a mathematical model was developed to simulate and discuss the influencing factors on the film thickness uniformity. The results of calculation and simulation showed that when the substrates are rotating axially and eccentrically,the targetsubstrate distance and eccentricity both affect the film thickness distribution. If the eccentricity is constant,the film thickness becomes thinner with increasing target-substrate distance,and the thickness uniformity tends to be improved. If the target-substrate distance is constant,the thickness uniformity becomes better then worse with increasing eccentricity. Moreover,if the substrate rotates axially and revolves round the target simultaneously,the thickness uniformity becomes better with increasing velocity ratio of axial rotation to revolution,and the effect of the thickness uniformity becomes smaller gradually if the ratio increases to a certain degree. Finally,we have taken relative experimental validation,and results comply with the simulation conclusion in general.
magnetron sputtering thickness uniformity eccentricity velocity ratio target-substrate distance
HUANG Ying GAO Shi-tie LIU Meng ZHANG He YANG Yue
Northeastern University,Shenyang 110004,China Northern Heavy Industries Group Co.,LTD,Shenyang 110141
国际会议
沈阳
英文
116-123
2011-05-22（万方平台首次上网日期，不代表论文的发表时间）