会议专题

Simulation and Design of PEM System for Reactive Sputtering Coating

In the reactive sputtering process,due to the hysteresis phenomenon,in order to deposit certain stoichiometric chemical compound film at a high deposition rate,the sputtering state should be maintained within the transitional region of the hysteresis loop area. Since the hysteresis is irreversible,it requires a kind of fast feedback to control the sputtering power or the reaction gas flow into the chamber. In this paper the PEM (plasma emission monitor) control system and the single neuron self-adaptive PID algorithm are designed for the reactive sputtering. The software Matlab is used to simulate the single neuron self-adaptive PID algorithm and the traditional non-adaptive PID algorithm. To take monitoring the spectral intensity of the reaction gas for example to analyze the simulation results,several conclusions can be drawn. The overshoot of the waveform output is 6% obtained when the traditional non-adaptive PID control algorithm is used which indicates that the reactive gas flow into the chamber is excessive and the target is poisoned. While the overshoot is zero the single neuron self-adaptive PID algorithm used which shows the target poisoning is avoided. The PEM using the single neuron self-adaptive PID algorithm responses faster the regulatory time about 0.5s than that using the traditional PID algorithm over 1.8s. The PEM system designed here can effectively avoid target poisoning and make the reactive sputtering maintain at an ideal state.

reactive sputtering PEM single neuron adaptive PID plasma OES

HUANG Ting CHEN Cai-hong JIANG Rong-heng ZHANG Yi-chen

Northeastern University,Shenyang 110004,China

国际会议

10th International Conference on Vacuum Metallurgy and Surface Engineering,Vacuum Engineering Conference 2011 and Vacuum Consultancy Workshop 2011(第十届国际真空冶金与表面工程学术会议、2011年真空工程学术会议、2011年真空咨询工作会议)

沈阳

英文

174-181

2011-05-22(万方平台首次上网日期,不代表论文的发表时间)