Adhesion Simulations and Experiments of Thick Diamond Films on the Substrate Temperature Field in the DC PJ CVD System

摘要：

High quality diamond film wafers with different thickness are prepared by high power DC arc plasma jet CVD (DCPJ CVD) method using a CH4/Ar/H2 gas mixture. The substrate temperature is very important to the stable deposition. The software of FLUENT 6.3 and GAMBIT are used to simulate the distribution of the substrate temperature field,the result indicated that the temperature is non-uniform,and turned down quickly out of the anode nozzle. The results of experiments are similar with the simulation. The diamond film wafers of 060mm diameter,lmm thickness were prepared successfully. Characterization by X-ray diffraction,Raman spectroscopy and SEM analysis are also carried out.

关键词： Substrate temperature field Simulation Experiment CVD diamond film

作者: CHEN Rong-fa ZHANG Xian-liang LIU Tao PAN Yi ZHU Rui

作者单位: Department of Mechanical Engineering,Yangzhou University,Yangzhou,225127,China

会议类型: 国际会议

会议名称: 10th International Conference on Vacuum Metallurgy and Surface Engineering,Vacuum Engineering Conference 2011 and Vacuum Consultancy Workshop 2011(第十届国际真空冶金与表面工程学术会议、2011年真空工程学术会议、2011年真空咨询工作会议)

会议地点: 沈阳

会议语种:英文

页码: 207-211

在线出版日期: 2011-05-22（万方平台首次上网日期，不代表论文的发表时间）