The performance of the Auxiliary Anode in Plasma Enhanced Sputtering
The distribution of plasma plays an important role in the process of magnetron sputtering. This paper takes the CC800 magnetron sputtering coating machine produced by Germany CemeCon Company as research archetype. Basing on the primary simulating model,which mainly consists of four unbalanced magnetron sputtering targets and one auxiliary anode,we use OPPIC (Object Oriented Particle in Cell) program to model the distribution of electrons and ions in the chamber whether the auxiliary anode exists or not. With the auxiliary anode,the plasma concentrates towards the auxiliary anode forming a new area to restrict the plasma,and the plasma density increases obviously. After comparing the particle distribution graphs and particle density curves,we prove that,when the voltage of auxiliary anode is proper,the auxiliary anode can expand the plasma region and increase the plasma density. At the end of this paper,we confirm that the further research will focus on the optimization of the simulating model parameters.
auxiliary anode plasma OPPIC magnetron sputtering
ZHANG Yi-cheng ZHAO Jin-yan QI Dan
Research Center of Vacuum and Fluid Engineering,Northeastern University,Shenyang 110004,China
国际会议
沈阳
英文
242-248
2011-05-22（万方平台首次上网日期，不代表论文的发表时间）