Net-Shape Forming Process for Diamond-Copper Composites with High Thermal Conductivity

摘要：

High volume fraction diamond-copper composites were successfully prepared by the combination of metal injection molding for the preparation of diamond preforms with monosized particles and copper pressure infiltration technique. The effects of major processing parameters on the properties of diamond preforms and diamond-copper composites were investigated. The results show that the optimal conditions are as follows: loading of diamond powder 62％, infiltration temperature 1450°C, infiltration pressure 30MPa, holding time 25min. Under the optimal conditions, the diamond-copper composites with diamond volume fraction of 62％ can obtain the best performance, with the relative density of 99.7％, the thermal conductivity of 530W/(m-K) , and the coefficients of thermal expansion from 5.5 ppm/K to 7 ppm/K as the temperature from 50℃ to 400℃. All these properties can meet the demands of electronic packaging materials.

关键词： diamond-copper composites electronic packaging injection molding infiltration

作者: Chi Yuan Jian Wang

作者单位: Department of Machinery, Weifang University, Weifang, Shandong, China Department of Architectural Engineering, Weifang University, Weifang, Shandong, China

会议类型: 国际会议

会议名称: 2010 International Conference on Circuit and Signal Processing(2010年电路与信号处理国际会议 ICCSP 2010)

会议地点: 上海

会议语种:英文

页码: 767-770

在线出版日期: 2010-12-25（万方平台首次上网日期，不代表论文的发表时间）