Precision Machining of Silicon Wafers Using Multi-cutters
The majority of integrated circuits are constructed on silicon wafers nowadays. Precision machining process has great potential to improve wafer quality at a low cost, this paper addressed a new method of machining silicon wafers and its general mathematical model to predict the locus of the machining lines and the distance between two adjacent machining lines using multi-cutters simultaneously. Mathematical expression of machining model was derived, experimental results on experimental device prove feasibility of this new machining method with multicutters.
silicon wafer precision machining mathematical model multi-cutters experiment
YAN Zhanhui
School of Mechatronics Changchun Institute of Technology Changchun,PR China
国际会议
长春
英文
349-351
2010-08-24（万方平台首次上网日期，不代表论文的发表时间）