The Experimental Research of the Non-brasive Cryogenic Polishing Monocrystalline Silicon Wafer Super-smooth Surface

摘要：

Following the development of IC technology, the IC is developed as high density, high integration, and high-performance. It requires that the semiconductor materials should have super-smooth surfaces in the process of machining chips. In this paper, the new technology of ice disc polishing to polish monocrystalline silicon without abrasive on the cryogenic condition is first put forward. The results of the experiment were recorded in detail. In this experiment, some factors on the impact of surface quality are analyzed.

关键词： monocrystalline silicon cryogenic polishing super-smooth surfaces

作者: Qu Shouping Zhang Zhongshu Liang Tianzhu

作者单位: Institute of Mechanical Engineering Changchun University Changchun,China Qiqihr Railway Rolling Stock Co.,Ltd. Qiqihr.China Institute of Mechanics Engineering Changchun University of Science and Technology Changchun,China

会议类型: 国际会议

会议名称: 2010 International Conference on Computer,Mechatronics,Control and Electronic Engineering(2010计算机、机电、控制与电子工程国际会议 CMCE 2010)

会议地点: 长春

会议语种:英文

页码: 445-448

在线出版日期: 2010-08-24（万方平台首次上网日期，不代表论文的发表时间）