Modification of Resin and its Application to Resin-bonded Diamond Wire Saw Manufacture

摘要：

The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.

关键词： Resin modification Fixed-abrasive wire saw Orthogonal design experiments

作者: W.B.Bi P.Q.Ge S.Q.Song Y.F.Gao Z.S.Wang L.Zhang

作者单位: Key Laboratory of High Efficiency and Clean Mechanical Manufacture, Ministry of Education,School of School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China

会议类型: 国际会议

会议名称: International Conference on Surface Finishing Technology & Surface Engineering(2010年中国国际光整加工技术学术会议 ICSFT 2010)

会议地点: 广州

会议语种:英文

页码: 393-397

在线出版日期: 2010-11-05（万方平台首次上网日期，不代表论文的发表时间）