A New Approach of Preparing Electromic Circuit On Textile Utilizing Electrothermal
Electroless plating has many advantages such as relatively low cost, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and the uniform and thick deposited metal for flexible circuit making. But it is also limited by poor accuracy, low speed and low repeatability. A new approach is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A parametric model is also established and the simulation is carried out The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future smart textile combining with flexible circuit.
Laser Induced lectroless Plating ( LIEP) flexible circuit electrothermal technology smart textile
Qiaoling Ji Yitao Chen Qiusheng Chen Xiaowei Ji Weimin Qi
School of Electrical and Engineering Wuhan Textile University Wuhan 430073, P.R.China School of Logistics Egineering Wuhan University of Technology Wuhan 430070, P.R.China Physics & Information Engineering Institute Jianghan University Wuhan 430056, P.R.China
国际会议
太原
英文
210-213
2010-10-22（万方平台首次上网日期，不代表论文的发表时间）