Study on the Test Method of Junction Temperature Change Procedure for Electronic Devices Based on Simulation
Quality of the performance and parameters of electronic devices under high-low temperature environments is one of the most important aspects for evaluating its reliability. To the problem that the junction temperature control of electronic devices is not accurate in large batch testing under high-low temperature environments, this paper establishes the junction temperature change equation with time based on the research on several test methods, then presents a method which uses the software of ANSYS to simulate the junction temperature change procedure with time. The relationship curve between them is obtained, which can guarantee the accuracy of control to the electronic device junction temperature change under High-low temperature test. Finally, a junction temperature measurement experiment with a typical packaged device is done, which validates the feasibility of this method.
junction temperature electronic devices simulation measurement
Gao Cheng Wang Xiangfen Lu Jing
Dept.of Reliability and System Engineering Beijing University of Aeronautics and Astronautics Xue Yuan Road No.37, HaiDian District, Beijing, China
国际会议
太原
英文
510-513
2010-10-22（万方平台首次上网日期，不代表论文的发表时间）