Thermal Analysis of Deep Sub-micron PD SOI MOSFET with Asymmetric Source and Drain
Focusing on the influence of self-heating effect on electrical properties of the SOI device, thermal analysis of the partially depleted (PD) SOI MOSFET with asymmetric source and drain is performed, and temperature distribution and electrostatic potential distribution of the device are simulated with TCAD tools. The results show that: the heat source of the device is the regions with the highest electrostatic potential; the lattice temperature of the device rises with the shrinking of channel length and silicon film thickness, and the former has more influence. PD SOI MOSFET with asymmetric source and drain is better in reducing self-heating effect than the other SOI devices.
asymmetric source and dram PD SOI i self-heating effect thermal analysis non-isothermal energy transport
Tang Wei Liu You-bao Wu Long-sheng
Xian Microelectronics Technology Institute Xian, China
国际会议
成都
英文
322-325
2010-07-07(万方平台首次上网日期,不代表论文的发表时间)