Optimum Design of A Step-Oxide Trench GatePower MOSFET with Low On-Resistance
A high voltage trench gate power MOSFET with the step-oxide gate trench is designed. The power MOSFET is characterized by the step-oxide in the deep trench. By extending the trench to the level above substrate, the drift region resistance is partially replaced by the resistance of accumulation layer and the therefore total on-resistance of power MOSFET can be reduced. Owing to the extended part of step-oxide gate, the electric field is modulated and high breakdown voltage)(BV) can be supported. And the high drift region doping concentrationN_d) contributes to a low specific on-resistance(Ron). A few groups of key structure parameters are investigated to make a tradeoff between breakdown voltage and specific on-resistance. An optimum breakdown voltage of 83V with 36.6mI2?mm2 specific onresistance is obtained.
trench power MOSFET step-oxide optimum design breakdown vollage(BV) specific on-resistance(Ran)
Chi Liu Quanyuan Feng
Institute of Microelectronics Southwest Jiaotong University, SWJTU Chengdu, China
国际会议
2011 International Conference on Information and Industrial Electronics(2011年信息与工业电子国际会议 ICIIE 2011)
成都
英文
549-552
2011-01-14(万方平台首次上网日期,不代表论文的发表时间)