Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit On Silicon Substrate for Application to Long Distance Wireless Power Transmission

摘要：

In this paper, for application to a long distance wireless power transmission, a highly miniaturized 14 power divider/combiner employing periodic structure was fabricated on semiconducting silicon substrate. The 1-4 divider/combiner showed good RF performances from 1 to 25 GHz, and its size was 1.08 x 0.63 mm2, which is 0.14％ of the size of the one fabricated on PCB.

关键词： Coplanar waveguide PACS Silicon RF1C AMP

作者: Jeong-Gab Ju Jang-Hyeon Jeong Bo-Ra Jung Eui-Hoon Jang Young Yun

作者单位: Department of Radio Sciences and Engineering Korea Maritime University Busan, Korea

会议类型: 国际会议

会议名称: 2011 International Conference on Information and Industrial Electronics(2011年信息与工业电子国际会议 ICIIE 2011)

会议地点: 成都

会议语种:英文

页码: 631-633

在线出版日期: 2011-01-14（万方平台首次上网日期，不代表论文的发表时间）