BUCKLING DISTRIBUTION OF THIN COMPRESSED FILM ON AN ORGANIC GLASS SUBSTRATE
Buckling of a film/substrate system represents a variety of applications, ranging from stretchable electronics to micronanometrology. In engineering, buckling is a structural failure mode to react to the bending moment generated by compressive load or other situations. Comprehension of thin-film buckling is important in many emerging applications where buckling control is needed, such as stretchable electronics, MEMS, thin-film metrology, and optical devices. In this paper, the buckling propagation of thin compressed titanium films deposited on organic glass substrates is investigated utilizing an optical microscope. The distribution of straightside buckling of thin film on a stiff substrate is studied under the influence of interface adhesion. The adhesion property of film/substrate system is characterized by adhesion energy per unit area at interface. Periodicity of buckling distribution of thin film is investigated by the optical microscope. The shape and periodicity of buckling under plane strain condition are derived theoretically by considering the large deflection of thin film and adhesion energy.
buckling nanomechanics interface thin film
H.K.Jia S.B.Wang L.A.Li X.L.Xue D.Q.Cui
Mechanics Department, Tianjin University,300072 Tianjin, China
国际会议
广州
英文
228-233
2010-12-17（万方平台首次上网日期，不代表论文的发表时间）