A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components
In recent years, assembling and packaging methods of Micro Electro Mechanical System (MEMS) components have been profoundly studied. The focus of this paper is presenting a novel alignment technique in waferlevel packaging. In conventional wafer-level strategies, either an Alignment Template (AT) must have special receptor sites according to the microchip geometry and its material, or the microcomponents should be additionally featured by circular and cross pegs for shape recognition stage. In this article, we have developed electrothermal microclamps (ETMCs) to hold and locate six microchips of 360x360×20 micrometers in a microfixturing cell. This is to provide accurate preliminary positioning for final flip-chip bonding process of wafer-level packaging on a main assembly board (MAB). The new approach enjoys the advantages of omitting special AT with receptor sites and using identical ETMCs for diverse assembly configurations. Being applicable for different types of microcomponent materials, it does necessitate no surface treatment on microcomponents such as Semidry uniquely orienting selforganizing parallel assembly (Semi-DUO-SPASS) technique. Comparing nickel and poly silicon as fabrication materials, corresponding values of input voltage to reach 3 micrometers displacement of the ETMC arm are estimated via finite element analysis to ascertain positioning and holding of microchips. Nickel showed to be a better choice for fabrication due to requiring lower input voltage and lower maximum resulting temperature. The simulation results are verified with published experimental measurements.
MEMS wafer-level packaging microfixture electrothermal actuation microclamp
M. Hamedi M. Vismeh P. Salimi
Mechanical Engineering Department University of Tehran Tehran, Iran
国际会议
2010 6th International Conference on MENS NANO,and Smart System(2010年微机电纳米、智能系统国际会议 ICMENS 2010)
长沙
英文
79-83
2010-12-14（万方平台首次上网日期，不代表论文的发表时间）