Silicon-Based Micro Pulsating Heat Pipe for Cooling Electronics
This paper reports a micro-pulsating heat pipe (micro-PHP) fabricated in a silicon wafer that consists of trapezoidal microchannels with a hydraulic diameter of 394um for electronic cooling applications. Electronic liquid FC-72 was used as the working fluid. To evaluate the maximum temperature reduction of the evaporator wall, experimental results of the vertical and horizontal-located microPHP at filling ratios ranging from 47％ to 62％ were compared with those measured from the empty micro-PHP (0％ filling ratio). Results show that incorporating a micro-PHP as an integral part of silicon wafer could significantly decrease the maximum wafer temperatures and reduce the intensity of localized hot spots. At a power input of 6.0W, reductions in the evaporator wall temperature of about 32.3℃ and 24.4℃were obtained for the micro-PHP at vertical and horizontal orientations, respectively. In addition, a CCD camera was employed to record the fluid movement inside microchannels and affirmed the existence of nucleation boiling and bulk circulation flow in the micro-PHP.
pulsating heat pipe MicroChannel silicon wafer filing ratio
Qu Jian Wu Huiying
School of Energy and Power Engineering Jiangsu University Zhenjiang, China School of Mechanical Engineering Shanghai Jiao Tong University Shanghai, China
国际会议
2010 6th International Conference on MENS NANO,and Smart System(2010年微机电纳米、智能系统国际会议 ICMENS 2010)
长沙
英文
109-112
2010-12-14（万方平台首次上网日期，不代表论文的发表时间）