A Comparative Study of Thin-film and Reynolds Equation Simulation Models for Squeeze Film Damping in MEMS Plate Structures

摘要：

Squeeze film damping effect of MEMS parallel plate structure was analyzed based on thin film and Reynolds Equation in ANSYS under the different Knudsen numbers. Perforation effect of parallel plate with certain size and operating frequency was achieved under the different Knudsen numbers, the simulation results of two methods are very close. For unperforated plate, when Knudsen number is below 0.01, the discrepancy of two simulations is nonsignificant, and it grows up with Knudsen number. But gas rarefaction effects related with Knudsen number was considered in heat transfer analogy theory and used viscosity modification according to Veijola model, two simulations get the same result. For perforated plate, the simulation discrepancy of two methods will be great because of channel flows effect and also grow up with Knudsen number, it cant be avoided even if the channel flows effect and viscosity modification were concerned in heat transfer analogy theory.

关键词： squeeze film damping MEMS plat Reynolds equation Knudsen number

作者: Liu Weiguo Wang Wei Peng Shoujun

作者单位: Micro-Optoelectronic Systems Labs Xian Technological University Xian, China

会议类型: 国际会议

会议名称: 2010 6th International Conference on MENS NANO,and Smart System(2010年微机电纳米、智能系统国际会议 ICMENS 2010)

会议地点: 长沙

会议语种:英文

页码: 141-145

在线出版日期: 2010-12-14（万方平台首次上网日期，不代表论文的发表时间）