Air Damping Effects of MEMS Parallel-plate Structure Using ANSYS Thin Film Analysis

摘要：

ANSYS thin film analysis was adopted to simulate the effects of squeeze film damping. The relation of damping effects versus operating frequency, velocity, material accommodation factor was analyzed, and the gas squeeze film damping and pressure distribution was simulated by steady-state analysis or harmonic analysis. Moreover, pressure distribution of damping effect in plate gap both with perforated holes and without holes, were determined and compared. Simulation results show that operating frequency and the structure of microstructures are the main influencing factors to air damping and perforated holes in plate gap can control stiffness coefficients of squeezed film damping.

关键词： MEMS microstructure plate movement air damping

作者: Zhang Xiongxing Peng shoujun Zou Jinlong

作者单位: Micro-Optoelectronic Systems Labs Xian Technological University Xian, China Science and Technology on Electromechanical Dynamic Control Laboratory Xian Institute of Electromec

会议类型: 国际会议

会议名称: 2010 6th International Conference on MENS NANO,and Smart System(2010年微机电纳米、智能系统国际会议 ICMENS 2010)

会议地点: 长沙

会议语种:英文

页码: 146-149

在线出版日期: 2010-12-14（万方平台首次上网日期，不代表论文的发表时间）