Bumpless WOW Stacking for Large-Scale 3D Integration

摘要：

Wafer-scale three-dimensional (3D) technologies beyond post-scaling, known as Wafer-on-Wafer (WOW), have been developed for high-density integration. WOW consists of four technology modules: wafer thinning, stacking, through-silicon-via (TSV) interconnects without bump electrode pads, and packaging. All modules are carried out at the wafcr scale. No degradation for advanced 35-nm SRAM logic and FRAM devices was observed with ultra-thinning below 10-μm for 300-mm and 200-mm wafers.

作者: Takayuki Ohba

作者单位: The University of Tokyo, 2-11-16 Yayoi, Bunkyo-ku, Tokyo 113-8656, Japan

会议类型: 国际会议

会议名称: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)

会议地点: 上海

会议语种:英文

页码: 70-73

在线出版日期: 2010-11-01（万方平台首次上网日期，不代表论文的发表时间）