On the Memory-on-Logic 3D IC for Secure Computing

摘要：

Memory-on-logic three-dimensional integrated circuit (3D IC) is an enabling technology to establish future low-cost and high-performance IC products, which will be widely used in the industry in the coming years. In this paper, such 3D IC is proposed to be used as a secure computing platform by utilizing the unique 3D architecture and 3D-induced physical unclonable functions (PUF). Using multiple layers of memory resources, the computation is based on look-up-table (LUT) arithmetic and logic functions are determined by the memory contents. Therefore, by encrypting the individual memory layers using PUF, the chip functions are efficiently protected.

作者: Wei Wang Tom T. Jing Larry Smith Sitaram Arkalgud

作者单位: College of Nanoscalc Science and Engineering, University at Albany, SUNY, Albany, NY 12222, USA Sematech International, Albany, NY 12203, USA

会议类型: 国际会议

会议名称: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)

会议地点: 上海

会议语种:英文

页码: 87-89

在线出版日期: 2010-11-01（万方平台首次上网日期，不代表论文的发表时间）