Wireless Inter-Chip Interconnects Using IR-UWB-CMOS

摘要：

Wireless inter-chip interconnects using impulse-radio based ultra-wideband (IR-UWB) CMOS transmitter and receiver were developed for future 3D integration. Silicon integrated antennas were fabricated on a Si substrate by use of conventional back-end metallization processes. Characteristics of on-chip antennas were investigated in terms of device and material parameters. A single-chip IR-UWB CMOS receiver with an on-chip antenna was also investigated for verifying synchronization and data recovery as well as bit error rates for inter-chip wireless interconnects. The receiver could recover 200 Mbps data from the Gaussian monocycle pulse signal, which was transmitted from an on-chip antenna of the other chip at a distance of 0.5 mm. Bit error rate of 6.89×10-9 for the distance of 9 cm was obtained in spurious environment.

作者: Takamaro Kikkawa

作者单位: Research Institute for Nanodevice and Bio Systems, Hiroshima University, Higashi-Hiroshima, Hiroshima 739-8527, Japan

会议类型: 国际会议

会议名称: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)

会议地点: 上海

会议语种:英文

页码: 623-626

在线出版日期: 2010-11-01（万方平台首次上网日期，不代表论文的发表时间）