1mW 4-5GHz packaged VCO with bonding-to-ground inductors

摘要：

A packaged VCO, which utilizes the heat-sink pad in Quad Flat Pack No-Lead (QFN) package to provide a ground connection for bonding wire inductors, is presented in this paper. The proposed VCO is designed to cover 4 to 5 GHz band and is able to work under a minimum of 0.9 V DC supply voltage with only 1 mW power consumption. It is fabricated in 0.18 urn standard CMOS process. It achieves the FOM of -193 dBc/Hz, and the measured frequency variation is less than 11％.

作者: Congyin Shi Le Ye Junhua Liu

作者单位: SOI Group, Institute of Microelectronics, Peking University, Beijing 100871, China

会议类型: 国际会议

会议名称: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)

会议地点: 上海

会议语种:英文

页码: 690-692

在线出版日期: 2010-11-01（万方平台首次上网日期，不代表论文的发表时间）