Chemical Vapor Deposition of Ga Dopants for Fabricating Ultrashallow p-n Junctions at 400C
Chemical Vapor Deposition (CVD) of Ga on Si is performed in a commercial Si/SiGe epitaxial reactor at temperatures from 400 - 650 ℃ and conditions for which the Ga deposits selectivity on Si and the reactivity of the Ga with Si is so low that a thinfilm deposition is achieved. Contact windows to c-Si are covered with a thin layer of Ga and contacted by sputtering Al/Si(l%). On the basis of an extensive electrical I-V characterization, it is concluded that the Ga gives a substantial doping of the Si at a temperature of 400℃ and the resulting p-n junctions are near-ideal.
Amir Sammak Lin Qi Wiebe B. de Boer Lis K. Nanver
DIMES, Delft University of Technology, Feldmannweg 17, 2628 CT, Delft, The Netherlands
国际会议
上海
英文
969-971
2010-11-01(万方平台首次上网日期,不代表论文的发表时间)