Improved Operation Characteristics for Charge-Trapping Flash Memory Devices with SiGe Buried Channel and Stacked Charge-Trapping Layers
Two approaches are proposed in this work to improve the operation characteristics of charge-trapping (CT) flash devices, namely, SiGe buried channel and stacked charge-trapping layer. SiGe buried channel with different Ge contents and various thicknesses of Si-cap layer on operation characteristics of CT flash devices were studied. The programming and erasing speeds of CT flash devices are significantly improved by employing SiGe buried channel. The retention properties of CT flash devices are satisfactory with suitable Ge content in SiGe buried channel and proper thickness of Si-cap layer. Moreover, the programming and erasing speeds of CT flash devices are significantly improved by applying Si3N4/HfxAl1-xO charge trapping layers due to the enhanced carrier capture efficiency with extra interface (Si3N4/HfxAl1-xO). The retention property is clearly improved as well.
Kuei-Shu Chang-Liao Li-Jung Liu Zong-Hao Ye Wen-Chun Keng Tien-Ko Wang Pei-Yi Gu Ming-Jinn Tsai
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan, Electronics and Opto-electronics Research Laboratories, Industrial Technology Research Institute, Hs
国际会议
上海
英文
1061-1064
2010-11-01(万方平台首次上网日期,不代表论文的发表时间)