A New TFT with Trenched Body and Airgap-Insulated Structure for 3D Capacitorless IT-DRAM Application
We propose a new TFT with trenched body and airgapinsulated structure (AITFT) for one-transistor dynamic random access memory (IT-DRAM) application. According to the TCAD numerical simulations, AITFT can obtain excess 212% sensing current window and less 42% retention time compared with the conventional TFT.
Jyi-Tsong Lin Tzu-Feng Chang Yi-Chuen Eng Chih-Hung Sun Hsien-Nan Chiu Chun-Yu Chen Chih-Hao Kuo Hsuan-Hsu Chen Po-Hsieh Lin
Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan ROC
国际会议
上海
英文
1133-1135
2010-11-01(万方平台首次上网日期,不代表论文的发表时间)