AIGaN/GaN Dual Gate MOS HFET for Power Device Applications
Dual gate AlGaN/GaN MOS HFET with Al2O3 as gate oxide layer was fabricated. In comparison with normal dual gate Schottky HFET, dual gate MOS HFET exhibits much lower gate leakage current, larger transconductance and output current. Besides, the dual gate MOS HFET shows excellent breakdown characteristic.
Rumin Gong Jinyan Wang Shenghou Liu Zhihua Dong Cheng. P. Wen Min Yu Yong Cai Baoshun Zhang
Insititute of Microelectronics, Peking University, Beijing, 100871, China Suzhou Institute of Nano-tech and Nano-bionics, CAS, Suzhou, 215125, China
国际会议
上海
英文
1353-1355
2010-11-01(万方平台首次上网日期,不代表论文的发表时间)