Mixed-Mode Simulation-Design for IEC-ESD Protection

摘要：

Electrostatic discharge (ESD) protection becomes essential to advanced integrated circuits (IC). Very fast IEC-ESD failure and protection design are emerging challenges for contemporary ICs, particularly for consumer and portable electronics. This paper presents a new mixed-mode IEC-ESD simulation-design method, which involves process, device, circuit and system level simulation to accurately address the ultra-fast IEC ESD phenomena. The new IEC-ESD design technique allows ESD design optimization and prediction. Experimental results are depicted to validate the new design technique.

作者: Fei Yao Xin Wang Shijun Wang Bo Qin Albert Wang Hongyi Chen Siqiang Fan Bin Zhao

作者单位: CitrusCom Semiconductor, China Dept. of Electrical Eng., University of California, Riverside, CA 92521, USA Dept. of Microelectronics, Tsinghua University, China Fairchild Semiconductor, USA

会议类型: 国际会议

会议名称: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)

会议地点: 上海

会议语种:英文

页码: 1596-1599

在线出版日期: 2010-11-01（万方平台首次上网日期，不代表论文的发表时间）