Study on The Accelerated Soakage Testing during The Reliability Evaluation of Plastic Package

摘要：

In the semiconductor industry, during the component level reliability evaluation, the non-accelerated soakage testing in the precondition is normally proceeded, which takes much time. In order to reduce the soaking time, three accelerated soaking conditions are studied with reference to nonaccelerated soaking condition (JEDEC Level 3 and JEITA Rank E) m. Under the three accelerated soaking conditions, the moisture gain and moisture distribution are studied and confirmed by FEA (Finite Element Analysis). Also, the failure is studied under the three accelerated conditions compared with those of non-accelerated soaking conditions. Thereby, the time to fail of the component is determined.

作者: Qian Min Shao-Ming Yang Yang Cuijun Yin-Huang Lin Yuan Hua Gene Sheu Cao Yunpeng Jung-Ruey Tasi Shang-Hui Tu Yu-Lung Chin Jin-Shyong Jan Chia-Hao Lee

作者单位: Microelectronics Department, Suzhou University, Suzhou 215021, China Department of Computer Science and Information Engineering, Asia University 500, Lioufeng Rd., Wufen Device Engineering Department, Vanguard International Semiconductor Corp. Hsinchu, 30077, Taiwan, Re Microelectronics Department, Suzhou University, Suzhou 215021, China Spansion Co. Ltd, Suzhou 215021

会议类型: 国际会议

会议名称: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)

会议地点: 上海

会议语种:英文

页码: 1964-1966

在线出版日期: 2010-11-01（万方平台首次上网日期，不代表论文的发表时间）