Partial SOI Power LDMOS with a Variable Low-k Dielectric Buried Layer and a Buried P-layer
A high voltage LDMOS on partial silicon-on-insulator (PSOI) with a variable low-k (relative permittivity) dielectric buried layer (VLKD) and a buried p-layer (BP) is proposed (VLKD BPSOI). In the vertical direction, the low k value enhances the electric field strength in the buried dielectric (E_1) and the Si window makes the substrate share the voltage drop, which leads to a high vertical breakdown voltage (BV). In the lateral direction, three interface field peaks are introduced by the BP, Si window and the VLKD, which modulates the fields in the top Si layer, VLKD layer and the substrate. A high BV is therefore obtained. Furthermore, the BP reduces the special onresistance (R_(on)) and the Si window alleviates the self-heating effect (SHE). Compared with the conventional PSOI, BV of VLKD BPSOI is enhanced by 43.5% and R_(on) is decreased by 26.5%.
Xiaorong Luo IEEE member Yuangang Wang Guoliang Yao Lianfei Lei Bo Zhang Zhaoji Li
State key Laboratory of Electronic Thin Films and Integrated devices University of Electronic Science and Technology of China, Chengdu, China
国际会议
上海
英文
2061-2063
2010-11-01(万方平台首次上网日期,不代表论文的发表时间)