Investigation of mechanical properties of one-dimensional nanostructures by a combined multi-probe platform and scanning microscopic system
INTRODUCTION New materials and nanostructures with superior properties in both mechanics and electronics are emerging in the development of novel devices. Engineering application of these materials and nanostructures requires accurate mechanical characterization, which, in turn, requires development of novel experimental techniques 1, 2. In this paper, we first introduce our multi-probe mechanical testing system, and then provide some typical studies on the mechanical behaviors of one-dimensional (1D) nanostructures. Topics include retrieving the Youngs modulus of a Si nanowire using tunable resonance method, analyzing clamping strength of electron beam induced deposition (EBID) for Si nanowires and the tungsten substrate, and investigating thermal fatigue behavior of nanometer scale interconnect lines induced by the alternating current. By applications of the multi-probe system mentioned above, we find this testing system can implement the clamping and the loading of the 1D nanostructure easily. Particularly, the probe based force sensor can simultaneously measure the applied load electronically with nanonewton resolution.
Probe Si nanowires Interconnect line Mechanical behaviors
Xide Li Lijuan Sun Xue Ling Liang Liu Dujuan Zeng
Dept. of Engineering Mechanics, A ML, Tsinghua University, Beijing, 100084 China Dept.of Engineering Mechanics, A ML, Tsinghua University, Beijing, 100084 China
国际会议
The 2nd International Conference on Nanomechanics & Nanocomposites(第二届国际纳米力学与纳米复合材料会议)
北京
英文
205-208
2010-10-10（万方平台首次上网日期，不代表论文的发表时间）