Optimization of Process Parameters in Lead-free Wave Soldering Based on Orthogonal Experiment and Analytic Hierarchy Process

摘要：

In order to solve the typical soldering defects in lead-free wave soldering, the Design of Experiment (DOE) was conducted to optimize the process parameters. Based on the printed circuit board(PCB) experimental results, the method of Analytic Hierarchy Process(AHP) was employed to analyze the experiment results quantitatively. Then the influential weights of each factor in different levels were obtained. It is concluded that the influential sequences of the four main process parameters in lead-free wave soldering are track speed, flux quantity, soldering temperature and preheat temperature;the optimal process parameters are as follows: flux quantity 40mL-min~(-1), preheat temperature 110℃, track speed 1.6nvmin~(-1) soldering temperature 265℃. Furthermore, the reasons of solder bridging and missing weld defects were discussed systematically according to the analysis results. This paper reveals the key direction to optimize the process parameters and provides an effective measure to improve the soldering quality in lead-free wave soldering.

关键词： Orthogonal experiment Analytic hierarchy process(AHP) Lead-free wave soldering Process parameters Printed circuit board(PCB)

作者: Fengfu Yin Xihua Zhang Hailong Wang Suiran Yu

作者单位: R & D Center, Haier Group Co., Qingdao 266103, China School of Mechanical Eng., Shanghai Jiaotong Univ., Shanghai. 200240 China

会议类型: 国际会议

会议名称: 2010 International Conference on Advanced Mechanical Engineering(2010年先进机械工程国际学术会议 AME 2010)

会议地点: 洛阳

会议语种:英文

页码: 641-647

在线出版日期: 2010-09-04（万方平台首次上网日期，不代表论文的发表时间）