会议专题

Sensitivity Effect of Thermal Conductivity on Die Stress

Stress is the root cause to hot forging die failure. Stress amplitude is affected by the material properties, such as thermal conductivity. In order to improve die service life, the relationship between thermal conductivity of die material and die stresses including thermal, mechanical and combined stress must be identified. A 2D FE model of cake shaped workpiece is developed to analyze thermal, mechanical and combined stress of hot forging die with different level thermal conductivity. Three kinds of stress distribution are explored. A relationship between stress and thermal conductivity and the principle for selecting hot forging die material in terms of thermal conductivity of die material are established.

thermal conductivity stress ANSYS hot forging die

Chenggang Pan Huachang Wang Jialin Zhou

Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan Univ School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, China Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan Univ

国际会议

2010 International Conference on Information Technology and Industrial Engineering(2010年信息技术与工业工程国际学术会议 ITIE 2010)

武汉

英文

791-794

2010-06-06(万方平台首次上网日期,不代表论文的发表时间)