Sensitivity Effect of Thermal Conductivity on Die Stress
Stress is the root cause to hot forging die failure. Stress amplitude is affected by the material properties, such as thermal conductivity. In order to improve die service life, the relationship between thermal conductivity of die material and die stresses including thermal, mechanical and combined stress must be identified. A 2D FE model of cake shaped workpiece is developed to analyze thermal, mechanical and combined stress of hot forging die with different level thermal conductivity. Three kinds of stress distribution are explored. A relationship between stress and thermal conductivity and the principle for selecting hot forging die material in terms of thermal conductivity of die material are established.
thermal conductivity stress ANSYS hot forging die
Chenggang Pan Huachang Wang Jialin Zhou
Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan Univ School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, China Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan Univ
国际会议
武汉
英文
791-794
2010-06-06(万方平台首次上网日期,不代表论文的发表时间)