A thermal design methodology for power SiGe HBTs with non-uniform emitter finger spacing
As an effective and feasible method, the technology of non-uniform emitter finger spacing has been used to alleviate the thermal effects and improve the uneven temperature profile in multi-finger power SiGe HBTs. However, for the HBT with dozens of emitter fingers, designing multiple finger spacing values becomes trivial and time-consuming. In the paper, a new thermal design methodology namely Grouping and Adjusting (GA) method is proposed to shorten design time of non-uniform spacing values. Taking a 30finger HBT for example, the detailed design procedure of non-uniform spacing values is presented, which shows that the peak temperature is lowed by 8 JK, and the maximum temperature difference is improved by 23.5％ when compared with the uniform one. Furthermore, three types of the formulas for designing the spacing values are proposed to meet the different requirement of the temperature profile.
D. Y. Jin W. R. Zhang B. L. Guan L. Chen N. Hu Y. Xiao R. Q. Wang
College of Electronic Information and Control Engineering Beijing University of Technology Beijing, 100022, China
国际会议
成都
英文
510-513
2010-05-08（万方平台首次上网日期，不代表论文的发表时间）