Scattering Parameters Analysis of the Vertical Interconnected Via in Microwave Multilayer Circuits

摘要：

The paper presents the scattering parameters analysis of the vertical Interconnected vias in microwave multilayer circuits. The vertical Interconnected vias can be divided into two parts which are known as the exterior structure and the interior structure and whose scattering parameters can be analyzed separately by the matrix-penciled moment method (MPMOM)and the equivalent impedance method in parallel planes.The general design rules have been summarized about vertical Interconnected vias in microwave multilayer circuits in the paper.

作者: Yu Tian Yu Liu Ling Tong

作者单位: College of Automation Engineering University of Electronic Science and Technology of China No.2006, Xiyuan Avn. West High-Tech. Zone.ChengDu (611731) .China

会议类型: 国际会议

会议名称: 2010 International Conference on Microwave and Millimeter Wave Technology(2010国际微波与毫米波技术会议 ICMMT2010)

会议地点: 成都

会议语种:英文

页码: 775-778

在线出版日期: 2010-05-08（万方平台首次上网日期，不代表论文的发表时间）