Design and Implementation of a LTCC-Based Receiver Front-end Module

摘要：

A S-band receiver front-end module using Low Temperature Co-fired Ceramic technology is presented to be small and reliable with the main passive components such as splitter, coupler, bandpass filter, resistors and capacitors embedded in LTCC substrates. The MCM-levd module with a dimension of 27mm×25mm×1.9mm, realized in interconnecting the active chips by micro-assembly technology, is shown to meet the requirements quite well in experimental test.

作者: LI Zhong-yun ZENG Geng-hua CHEN Peng YANG Jian-yu

作者单位: Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China De Dept. of Electronic Engineering, Univ. of Electronic Science and Technology of China, Chengdu 610054 Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China

会议类型: 国际会议

会议名称: 2010 International Conference on Microwave and Millimeter Wave Technology(2010国际微波与毫米波技术会议 ICMMT2010)

会议地点: 成都

会议语种:英文

页码: 1053-1056

在线出版日期: 2010-05-08（万方平台首次上网日期，不代表论文的发表时间）