Film Thickness Modeling on Spray Cooling without Boiling
(0) Spray cooling appears a safer approach and more promising for electronics cooling applications. It also has been exhibited to be an effective method to dissipating high heat flux with low coolant mass flux at low wall superheats. Although lots of experiments have been performed by different researchers, theoretical understandings of spray cooling are still limited due to the intrinsic complexity of involved mechanisms. The film shape and film thickness are two important parameters. Most of the researchers considered the film to be a plane during their study, while some others did not think so. Nevertheless, everyone knows that the film has much effect on the cooling performance of a spray system. The main purpose of this paper is to open up new grounds for theoretical research on the film of spray cooling. Considering velocity slip boundary condition, simple models of the thickness of the liquid film were established, based on the continuity, momentum and energy governing equations. It shows that the film could be either a plane or some other shape, such as paraboloid liked, depends on the velocity distribution of the spray.
Spray Cooling Film Thickness governing equation
Y.X.Guo J.Y.Jia S.R.Zhou
School of Electro-Mechanical Engineering, Xidian University, China Intel Asia-Pacific Research & Development Ltd, Shanghai, China
国际会议
西安
英文
859-863
2009-07-11（万方平台首次上网日期，不代表论文的发表时间）