Preparation of SiCp/A356 electronic packaging materials and its thixo-forging
The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum alloy was fabricated by mechanical mixing method, and the SiCp/Al composite billet was formed by thixo-forging to manufacture the electronic packaging shell. The microstructure of the produced part was investigated. Two different thixo-forging procedures for manufacturing electronic packaging shell were analyzed. The results show that after being heated to 600℃ and held for 3 h, SiCp has good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet can meet the requirements of thixoforging. When the billet was remelted to 580℃, held for 10 min, the homogeneous microstructure with the best thixoformability can be realized. The thixo-forging of electronic packaging shell is feasible.
SiCp/Al composite electronic packaging shell thixo-forging mierostructure
WANG Kai-kun KANG Yong-lin SONG Pu-guang XU Feng LI Xian-hui
School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China
国际会议
北京
英文
988-992
2010-09-16（万方平台首次上网日期，不代表论文的发表时间）