Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

摘要：

Based on the research of modern electronic packaging materials,thixo-forming technology was used to fabricate electronic packaging shell.The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D,then the flow velocity field,equivalent strain field and temperature field were analyzed.The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation.The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites,and high volume fraction of SiCp with homogeneous distribution can be achieved,being in agreement with the requirements of electronic packaging materials.

关键词： thixo-forming SiCp/A356 composites electronic packaging shell numerical simulation

作者: WANG Kai-kun WANG Fu-yu CHEN Xue-jun WANG Lu MA Chun-mei

作者单位: School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 1 East China Research Institute of Electronic Engineering, Hefei 230088, China

会议类型: 国际会议

会议名称: The 11th International Conference on Semi-Solid Processing of Alloy and Composites(第11届合金与复合材料半固态成形国际会议)

会议地点: 北京

会议语种:英文

页码: 1707-1711

在线出版日期: 2010-09-16（万方平台首次上网日期，不代表论文的发表时间）