Finite Element Analysis on the Ability of Solder Joints to Resist Thermal Fatigue

摘要：

The purpose of this paper is to study the ability of solder joints to resist thermal fatigue. 2D simplified models of Plastic Ball Grid Array package (PBGA) structures with ten different solder joints obtained from surface mount experiment are established by finite element software, then stress-strain response of solder joints subjected to the thermal cycle load are calculated. And the effects of shape parameters of solder joints on the ability to resist thermal fatigue are discussed. Results indicate that for the same material and volume solders, the solder joints which have higher height, smaller diameter and contact angle have a stronger ability against thermal fatigue, and that the thermal fatigue characteristics are also greatly influenced by the solder outlines. Comparing with SP solder joints, LF solder joints have stronger ability against thermal fatigue.

关键词： Solder joints Shape parameters Thermal fatigue

作者: Xue-Xia Yang Yu Zhang Xue-Feng Shu

作者单位: Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology Taiyuan 03 School of Mechanical Engineer and Automation, Northeastern University, Shenyang 110004,China

会议类型: 国际会议

会议名称: The 2nd International Conference on Advances in Product Development and Reliability(第二届产品开发与可靠性进展国际会议 PDR2010)

会议地点: 沈阳

会议语种:英文

页码: 738-742

在线出版日期: 2010-07-28（万方平台首次上网日期，不代表论文的发表时间）