Development and Application of Unsoldering Equipment for Printed Circuit Boards Scraps
The realization of electronic components nondestructive unsoldering sepamtion from PCB scraps has ever been a tough challenge for eletronic and electrical products’recycling.According to the PCBs structural feature，based on the analysis and comparison of existing unsoldering methods，liquid solder tin is selected to heat and melt the solders of PCB scraps，and the mechanical impact and vibration are used to achieve the electronic components unsoldering purpose.The mechanical structure layout and the control system composition of the unsoldering equipment are given in the paper.The unsoldering process is introduced in detail.and the gasses and dusts generatad in the procedure of unsoldering are collected and disposed properly.Finally the unsoldering prototype is developed and put to use in a recycling demonstrating line of electrical home appliances.Practice shows that the equipment has advantages of efficiency，safety，reliability，energy-saving and environmental protection，moreover，the damage rate of the electronic components is low.
Printed Circuit Board (PCB) Unsoldering Electronic components Recycle
WANG Yu-lin SONG Shou-xu LIU Guang-fu LIU Zhi-feng
School of Mechanical & Automotive Engineering,Hefei University of Technology,China
国际会议
17th CIRP International Conference on Life Cycle Engineering(国际生产工程科学院(ICRP)第17届生命周期工程会议 LCE 2010)
合肥
英文
312-316
2010-05-19（万方平台首次上网日期，不代表论文的发表时间）