Electrochemical corrosion behavior of Cu-15Ni-8Sn alloy in marine microbial medium
A comparative study of the corrosion behavior of the copper-nickel-tin alloy in a nutrient–rich simulated seawater-based nutrient-rich medium in the presence and the absence of the marine bacteria was carried out by electrochemical experiments, microscopic methods. Comparing to the corresponding control samples, the electrochemical data demonstrated that the presence of the bacteria accelerated the corrosion of the alloy. Scanning electron microscopy (SEM) images revealed the occurrence of micro-pitting and intergranular corrosion underneath the biofilm on the alloy surface.
copper-nickel-tin alloy microbiologically induced corrosion polarization EIS SEM
Yanhua Lei Yansheng Yin Chaohong Liu Xueting Chang Yan Chen Sha Cheng
Institute of material science and engineering, Ocean university of China, Qingdao 266100, PR China
国际会议
青岛
英文
1099-1102
2009-10-09（万方平台首次上网日期，不代表论文的发表时间）