Electrical behavior of SiCp reinforced copper matrix composites by hot pressing
SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. ％ were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.
SiCp/Cu composite electroless copper plating electrical conductivity
Changchun Wang Guanghui Min Suk-bong Kang
Physics department, Linyi Normal University, Linyi 276005, P.R. China Key Laboratory of Liquid Structure and Heredity of Materials, Ministry of Education School of Materi Korea Institute of Materials Science, 66 Sangnam-dong, Changwon 641-010, Korea
国际会议
青岛
英文
1579-1582
2009-10-09（万方平台首次上网日期，不代表论文的发表时间）