Miniaturized Bandpass Filters Based on Multilayer Substrate Technologies
Novel concept of bandpass filters focused on their miniaturization, cost-effectiveness and high integration in a chip-package system has been discussed in the paper. This concept is based on a three-dimensional architecture, in which both a vertical transition and a planar transmission line disposed in a multilayer substrate, are used as building blocks of the filters. Here, the vertical transition is formed as a specific coaxial wave guiding structure by a signal via, being inner conductive boundary, and ground vias, serving in the role of an outer conducive boundary. The resonant stub element in the bandpass filters is constructed as a part of the vertical transition. In this part, a artificial dielectric, having the relative permittivity higher than that of the substrate dielectric, is formed. This artificial dielectric is obtained by conductive plates connected to the signal via, and controlling its relative permittivity is carried out by a number and dimensions of these plates. As a demonstration of the concept applicability, single-band and dual-band bandpass filters in a multilayer printed circuit board are presented. Both types of the filters are formed by two vertical transitions connected by a stripline. Simulated and measured data, which are in a good agreement, display a high electrical performance of the filters and a good perspective for their implementation in modern and next-generation communication systems.
Taras Kushta Hisashi Ishida Takashi Harada
System Jisso Research Laboratories, NEC Corporation, Japan
国际会议
2010 International Conference on Communications,Circuits and Systems(2010年通信、电路与系统国际会议)
成都
英文
621-624
2010-06-28（万方平台首次上网日期，不代表论文的发表时间）