Thermal Effect on Interconnect Current Density Estimation

摘要：

In this paper the methodology with thermal effect considered for predicting the maximum allowed current density Jmax in Copper (Cu) based interconnect is proposed. Based on the more accurate Jmax, an improvement on (jL) product-filtering algorithm for circuit level electromigration reliability analysis is discussed, which can guide us the reliability concern in the circuit design and layout process.

作者: Chaoyang Zhao Xuliang Zhang Ming Yao

作者单位: School of E.E., University of Electronic Science and Technology of China, Chengdu, China

会议类型: 国际会议

会议名称: 2010 International Conference on Communications,Circuits and Systems(2010年通信、电路与系统国际会议)

会议地点: 成都

会议语种:英文

页码: 862-865

在线出版日期: 2010-06-28（万方平台首次上网日期，不代表论文的发表时间）