Ag Migration Induced Reliability Concern on Micro-electro-mechanical Structure
A structure with 70μm space between two Ag bulks was designed to evaluate the reliability performance of micro-electro-mechanical structure. THB (Temperature Humidity with Bias), 85℃/85％RH (Relative Humidity) with 4.0V DC bias, was used as the environmental test conditions. SEM (Scanning Electron Microscope) and EDX (Energy Dispersive X-ray Detector) analysis showed that Ag migration over the isolating space induced about hundreds of times of the leakage current increase between the two Ag bulks after THB 200-hr and 500-hr stress. Chlorine element was also found in the migrated particles combined with Ag. It is inferred that the electrochemical reaction between Ag and H2O with the presence of Cl anion contributed to the Ag migration. This case can also be taken as a reference for failure analysis engineers who encounter the similar failure phenomena.
P. F. Zheng W. C. Dong V. Chang Y. H. Liu G. Li C. K. Ji M. Li
Semiconductor Manufacturing International Corporation, Shanghai 201203, China
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
269-273
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）