会议专题

UVision Solution for High Detection Sensitivity at the Stitches

The sensitivity on stitch areas is always a problem for defect inspection. As the design rule shrinks, small defects in any dense area are becoming critical including in the stitches. Therefore to improve the sensitivity on stitch areas is now become a must for the new generation device. Applied UVision Brightfield inspection system provides the capability to combine different cells in one scan. This feature makes it possible to define the repetitive stitches as cell and scan with Cell-to-Cell mode. Two different approaches are discussed in this paper. (1) Small stitches combined with memory Cell and scanned with Cell-to-Cell as a whole; (2) Large stitches defined as new standalone Cell and scanned with Cell-to-Cell. The result shows that with the application of the Cell-to-Cell to the stitch areas, the sensitivity was significantly improved, and the DOI capture rate could be increased by as high as 10 times.

Yin Xiang Xiaojun Luo Wensheng Li

Applied Materials China

国际会议

China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)

上海

英文

289-292

2010-03-18(万方平台首次上网日期,不代表论文的发表时间)