会议专题

CHALLENGES OF SMART SYSTEMS INTEGRATION

As a result of the growing complexity and miniaturization of innovative products systems integration is becoming more and more important for scientific and technical development. The micro and nano system technologies as well as electronics are playing a key role in todays product development and industrial progress. They enable the integration of mechanical, electrical, optical, chemical, biological and other functions into a very small space with dimensions ranging from sub micrometers up to some millimeters. This paper presents three examples of MEMS sensors developed at Fraunhofer ENAS and Chemnitz University of Technology and the approaches for their integration into smart systems. The first one is an active radio frequency identification label for the monitoring of shock, inclination and temperature during transportation processes. A MEMS spectrometer and gyroscopes will be demonstrated. Special emphasis is given to MEMS /nanointegration.

T. Gessner M. Vogel K. Hiller T. Otto A. Bertz D. Billep

Fraunhofer Research Institution for Electronic Nano Systems, Chemnitz 09126, Germany Center for Micr Fraunhofer Research Institution for Electronic Nano Systems, Chemnitz 09126, Germany Center for Microtechnologies, Chemnitz University of Technology, Chemnitz 09107 Germany Center for Microtechnologies, Chemnitz University of Technology, Chemnitz 09107, Germany

国际会议

China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)

上海

英文

295-300

2010-03-18(万方平台首次上网日期,不代表论文的发表时间)