Optimization of Film Uniformity by Electrochemical Copper Deposition Chamber Design
The impact of chamber design parameters on the non-uniformity of Cu film deposited by electrochemical method were investigated quantitatively by simulating the film growth process. These parameters include chamber geometry, electrolyte flow path, electrode configuration, and electrical field division and isolation. Further studies were conducted to optimize basic process parameters such as deposition current and current distributions on electrodes.
Xi Wang Chuan He Yue Ma
Advanced Copper Metallization Research (Shanghai), Inc., Pudong Cai Lun Road ＃1690, Building 4, Shanghai, 201203 P. R. China
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
301-307
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）