Comparative Study of Photosensitive versus Non-Photosensitive Developer-Soluble Bottom Anti-Reflective Coating Systems
Developer-soluble bottom anti-reflective coatings (DBARCs) were originally designed for use in implant lithography processes. Throughout the development cycle, two main DBARC platforms emerged, nonphotosensitive DBARC (non-PS DBARC) and photosensitive DBARC (PS DBARC). While both platforms have been able to achieve acceptable performance for implant processes, each has advantages and disadvantages. The characteristics of each system are used to recommend a platform for use in various implant processes. DBARC processes are now being compared to single-layer resist and dry BARC processes due to additional applications such as wet-etch layers for high-k dielectric metal gate (HKMG). Integrating a new technology into production is complicated. Therefore, for each of these new applications, the different DBARC platforms have been reviewed to compare performance. The analysis allows us to recommend a DBARC and a favorable process for each application, thereby decreasing development time and cost.
J. Lowes C. Stroud A. Guerrero C. Washburn P. Raj
Brewer Science, Inc., Rolla, Missouri 65401, USA
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
503-508
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）