Application and Advantage of CMP in Silicon Wafer Reclaim
In this paper, a silicon CMP process has been developed inside semiconductor fabrication to reclaim bare silicon wafers for cost and time reductions. Firstly, the high level defect after CMP was encountered and mainly particle; after related polishing and cleaning processes were optimized, the defect count was much reduced but still higher than the specification; finally, the defect count was dramatically decreased and met the specification by adding a surfactant (TMAH) in polishing. The effect of surfactant on defect reduction is also discussed in this paper.
Changxing Tan Shiwei Xiong Runtao Zhao Ying Xu Xucheng Wang Weifeng Zhang Shan Wang
Applied Materials, Shanghai, China Wuhan Xinxin Semiconductor Manufacturing Corporation, Wuhan, China
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
539-544
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）